Our premium comes from:
Cost optimization: increase the thermal conductivity by 30% and reduce the cost of heat dissipation components by 15%.
Failure rate: the average after-sales problems are reduced by 60%.
Value positioning: 6-12 months can recover the initial investment through cost reduction and efficiency increase.
The SCH Series is a high-performance DAF/DDAF (Die Attach Film) designed to streamline and enhance the advanced packaging process....
The DEEPETCH DP-QPA2611 is a high-performance X-Band (8–12 GHz) Gallium Nitride (GaN) Power Amplifier...
The DEEPETCH DP-ROS-40121 is a premium, solvent-free epoxy die attach adhesive engineered for the most...
The Diamond Heat Spreader is a highly efficient thermal management material engineered for the most demanding...
Molybdenum copper composite: adjustable CTE, high conductivity, lower density than tungsten copper. No...
Tungsten copper composite: low CTE, high conductivity. Ideal for RF, power, optical packaging.
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
