News Center

Table of Contents

    Category

    Related News

    Wafer-Level Packaging: Fan-In vs Fan-Out and How to Choose
    A smaller die does not always produce an easier package. If the chip still needs the same number of connections,...
    Wafer Dicing: How to Select a Process and Control Edge Chipping
    A wafer can pass electrical test and still lose usable dies during separation. Edge chips, cracks, contamination...
    Flip Chip vs Wire Bonding: Choosing an Interconnect for Your IC Package
    The practical answer to flip chip vs wire bonding starts with the die drawing, not the package label....
    ABF Substrate vs BT Substrate: How to Choose for IC Packaging
    An ABF substrate becomes a strong candidate when a package genuinely needs dense escape routing and several...

    How can the ceramic tube shell guarantee the long-term reliability of the vehicle sensors?

    Aluminum nitride (ALN) ceramic tube shell through multilayer compaction sintering process, porosity <0.01%, air tightness reaches the MIL-STD-883H standard, can withstand-40℃ ~150℃ extreme temperature cycle and 15G mechanical vibration. With the lidar (LIDAR) sensor, the detection distance can be increased to 300 meters, and the failure rate is less than 0.01%.

    Share to:

    Facebook
    Twitter
    LinkedIn

    Recommended products